December 2024

The EMVA Team is in the final stages to conclude the program of next year’s Business Conference in Rome, Italy.
Several high-calibre speakers already confirmed their active contribution – conference attendees may expect presentations from META, EXCELITAS, BARILLA, VOLUME GRAPHICS, ST MICROELECTRONICS and NIREOS, just to mention some.

Rome is probably one of the most frequented and attractive cities wordwide, therefore conference registration and especially hotel booking at the conference venue should not be postponed!

Don’t wait until next year!
Get all the details by clicking the banner below now!

What drives vision specialists to join Standard working groups?
Why do companies support active contribution to Standard development?

Continuing its interview series the EMVA this time asked Mr. Eric Bourbonnais, Technical Leader / 2D Mid-Market at Teledyne Vision Solutions, about his motivation to join the work on standardisation.I have been involved in the development of the GenICam standard since 2006. As a GigE Vision camera manufacturer, my company needed to learn more about this new standard, which was mandatory for GigE Vision. Participating in the GenICam working group gives me the opportunity to influence the GenICam standard in a way that benefits my company. It also allows me to collaborate with members from other companies, facilitating the exchange of ideas to find better solutions for the standard while simultaneously enhancing my own knowledge. …. Read more ›

In 2022 it was our pleasure to welcome Prof. Dr. Wolfram Pernice, scientist at the Heidelberg University, presenting at the European Machine Vision Forum.
Now Dr. Pernice received the Gottfried Wilhelm Leibniz Prize of the German Research Foundation (DFG).

At the Kirchhoff Institute for Physics Prof. Pernice heads the research group “Neuromorphic Quantum Photonics”. The award – the most important research advancement prize in Germany – comes with prize money of 2.5 million euros. Read more ›

EMVA Board & Management congratulate for this well deserved achievement.

We are pleased to announce that Sebastien Granatelli has joined Euresys as Sales Manager Europe in charge of Sensor to Image products.
He is responsible for developing the sales of the FPGA IP Core product lines, as well as the custom development and manufacturing activities.
Sebastien is Dipl.Ing. (FH) in Photonics and Image Processing from the Darmstadt University of Applied Sciences and has 20 years of experience in machine vision, image acquisition and processing.
Sebastien is looking forward to further serve the industry from within Euresys/Sensor to Image.

In collaboration with our customer VMT GmbH, we developed an automated solution for inspecting tunnel segments prior to installation. This system operates underground within a tunnel boring machine. It investigates the surface of the concrete for defects and checks for missing inbuilt objects. The system’s advanced sensors and imaging technology ensure that each segment meets stringent quality standards before it is used. By integrating this solution into the tunnel boring machine, we enhance the efficiency and safety of the tunneling process, reducing the risk of structural issues and costly delays. Read more ›

Teledyne DALSA is pleased to introduce Z-Trak™ 3D Apps Studio, a suite of software tools developed for in-line 3D machine vision applications. Designed to work with Teledyne DALSA’s Z-Trak family of laser profilers, it simplifies 3D measurement and inspection tasks on production lines. Capable of handling 3D scans of objects with varied surface types, sizes and geometric features, Z-Trak 3D Apps Studio is ideal for factory automation applications across a wide range of industries including electric vehicles (EV batteries, motor stators etc.), automotive, electronics, semiconductors, packaging, logistics, metal fabrication, lumber, and many more. Read more ›

JAI is pleased to announce the release of two new high-speed CMOS line scan cameras in its Sweep Series: the SW-16000TL-CXP4A trilinear color model and the SW-16000M-CXP4A monochrome model.

JAI’s new camera models offer 16K resolution with large 5 μm square pixels, coupled with a CoaXPress 4 x CXP-12 interface delivering high data throughput. This combination of high resolution and high-speed connectivity makes these cameras ideal for manufacturing processes that require detailed vision inspection of small features at high speeds. Read more ›

Our two series outperform other brands with exceptional resolution, contrast, and up to 90% relative illumination. The MFA series supports up to 25MP 1.2″ sensors, offering ultra-high uniformity and various focal length options. This makes it ideal for versatile applications. On the other hand, the WWT series excels in image quality under specified parameters. Due to the fixed aperture, focal length, and working distance, it is easy to install and use. Built for stability, it highlights anti-shock.
We offer fast sampling, rapid delivery, and a 1-year warranty for our products service for you. Read more ›

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