May 2023 – EMVA

Focal topic:
Real-world Machine Vision Challenges – Coping with Variability and Uncontrolled Environments

Under the overall title ‘Research Meets Industry‘ the European Machine Vision Forum aims to foster interaction between the machine vision industry and academic research to learn from each other, discuss the newest research results as well as problems from applications, learn about emerging application fields, and to discuss research cooperation between industry and academic institutes.

EMVA and main sponsor Wageningen University & Research are looking forward to the forum taking place 12-13 October at the Omnia Dialogue Centre in Wageningen, The Netherlands.

We proudly announce that keynotes will be given by Prof. Dr. Alfred M. Bruckstein (Technion IIT, Israel), Prof. Dr. Christophe Cudel (Université de Haute-Alsace, France) and Prof. Dr. Albert Theuwissen (Harvest Imaging, Belgium).

Early-Bird-Tickets offering fee reduction as well as opportunities to join in as exhibitor at the forum accompanying table-tops are still available.

Don’t miss the outstanding opportunity and click below for more insights!

From 4-6 May 2023 the vision community met in Seville, Spain, for the annual EMVA highlight event and at this occasion celebrating EMVA’s 20th anniversary. Around 110 registered conference attendees enjoyed an highly interesting conference program and used the excellent networking opportunities to exchange ideas and discuss new business cases.

With 139 pre-scheduled face-to-face meetings – a new record! – the conference breaks were extensively used to meet & greet new players in the industry as well as catching up with long-lasting business partners.

A big step towards more diversity could be achieved by having five female vision experts on stage. Dr. Anna Lukasson-Herzig – CEO of nyris GmbH -, Anna Petrovicheva – CTO at OpenCV.ai – and Dr. Petra Gospodnetic – Group Leader at Fraunhofer ITWM – contributed with inspiring talks. Nuria Garrido López – Continental Automotive – and Petra Thanner – AIT – shared their expertise during the panel discussion.

The EMVA Young Professional Award 2023 goes to Dr. Pieter Blok for his work ‘Advanced deep learning for harvest robotics’. Read more ›

The startup Medabsy UG provides an online platform for creating digital twins of machine vision systems, making it possible to solve image processing projects before having access to the required hardware. This involves inserting optical components (cameras, lighting, lenses etc.) from a digital catalogue, as well as the 3D file of the object to be measured into the 3D-editor. The software then generates photorealistic images from the camera perspective, which can then be used for algorithmic image processing.
Read more ›

TKH Group NV (“TKH”) announces that it has reached agreement on the acquisition of 100% of the shares in Euresys Group (“Euresys”) a leading innovative high-tech designer and provider of software for 2D and 3D image analysis, as well as video capture and processing.
The company delivers the industry’s most reliable and versatile family of frame grabbers. Frame grabbers allow images from a camera to be captured and transferred to the host memory of a PC for processing. Other activities of Euresys consist of machine vision software, IP Cores and custom products.
Read more ›

Active Silicon recently launched the Harrier IP camera series for networked image and video transmission. With the addition of WiFi capability, Harrier autofocus-zoom cameras have added even more flexibility to Active Silicon vision systems. Harrier IP Camera Interface Boards with a wireless module fitted support wireless communications over WiFi. Using the Harrier IP Camera Interface Board technology, Harrier IP cameras transmit and receive data over a network or the internet. The interface board compresses the camera LVDS video signal (using H.264) and converts it to an RTP video stream that is transmitted across the network. Read more ›

Advantech, a leading provider of industrial edge AI solutions, has announced the release of systems powered by the NVIDIA® Jetson Orin™ NX and Jetson Orin Nano™ system-on-modules. To help accelerate the process of development to deployment for AI developers, Advantech provides the systems with great flexibility, including a fanless computer, developer kit, and solution kit. Developers can test AI models and related peripherals on the developer kit and solution kit. Read more ›

Low installation effort, prompt commissioning, optimized time-to-market: AT recently launched its AT Solution Package, a fully comprehensive software package that represents an innovative all-in-one solution for users of AT 3D sensors and infrared cameras. The newly developed Software Development Kit (cxSDK) not only combines all previous software features in one place, it also includes numerous additional tools that enable customers to put their new sensors into operation within ten minutes. Read more ›

Teledyne DALSA is pleased to announce that its Linea™2 4k Multispectral 5GigE line scan camera is now in production. This new camera takes vision systems to the next level with its performance and value, offering a 5GigE interface with five times the bandwidth of the Linea GigE camera.

The Linea2 4k Multispectral 5GigE simultaneously captures high resolution RGB plus Near Infrared (NIR) multispectral images to reveal invisible features that cannot be detected using visible lighting alone.

Excelitas Technologies® Corp announces the launch of its advanced MachVis 5.4 Lens Configurator software. The updated platform offers streamlined lens selection for vision system designers and engineers with a focus on user-friendly features and improved lens selection algorithms.
MachVis 5.4 software enables identification and configuration of lens solutions and mechanical accessories among Excelitas LINOS® Machine Vision Lenses, Optem® FUSION Micro-Imaging, Qioptiq mag.x Microscopy Systems, and now includes PCO® Cameras. Read more ›

Focuz offers a complete service from manufacturing process development to
finished and tested products, from prototypes, to small and large volumes for:
industrial, biomedical and automotive applications
Image sensor packaging
• Clean Room Assembly (class 100) with ESD Control)
• Wafer Dicing • Die Attach: X-Y, Rotation & Tilt accuracy
• Wire Bonding: Ball & Wedge • Die bonding • Glass Lid Sealing
• All Package Types PCB, Flex, Ceramic, Metal, Leadfree
+ Focuz provides drop shipments worldwide, supply chain management
+ competitive low-cost structure & various clean rooms & 100% IP protection
+ Free trade agreement with Southeast Asia / tax-&-duty free shipments
A new plant will be opened mid of 2023. Read more ›

FRAMOS, a leading global supplier of imaging components, announced the launch of a new development kit for vision system engineers who are working to develop Time-of-Flight devices for industrial and robotics applications.
The FSM-IMX570 Devkit provides vision system engineers with a simple, coherent framework for quickly developing a working prototype of an embedded indirect Time-of-Flight (iToF) embedded vision system based on Sony’s leading iToF technology. The development kit is built around Sony’s IMX570 iToF image sensor, and includes the necessary hardware modules, software drivers, and documentation to allow engineers to integrate the system with widely-used platforms like NVIDIA’s® Jetson™ embedded computers and create a working camera prototype within a few hours. Read more ›

PCIe-NX154PoE is an intelligent 4-port 2.5GbE PoE+ frame grabber card fueling 100 TOPS AI inference performance for modern vision inspection, intelligent video analytics and surveillance/ security applications. Powered by NVIDIA’s Jetson Orin NX system-on-module, PCIe-NX154PoE delivers 100 INT8 TOPS AI performance via its 1024 CUDA cores, 32 Tensor cores and 2 NVDLA® engines. It also features four 2.5GbE PoE+ ports with a 50W total PoE power budget to connect and power industrial GigE cameras or IP cameras. Read more ›

As an extension of the HR camera series, SVS-Vistek presents the hr65CX12. This camera impresses with a high resolution of 9,344 x 7,000 pixels as well as an extremely powerful interface: Four CoaXPress-12 Connections transmit up to 12.5 Gbps per line and thus ensure that the extensive image data of up to 71 fps are available for further processing in the PC without delays.
A special technical highlight of the hr65CX12 is a Global Shutter, which distinguishes the new SVS-Vistek HR camera from numerous other High-Resolution cameras. In contrast to cameras with Rolling Shutter, Global Shutter cameras, in which all pixels are exposed and read out simultaneously, considerably simplify image acquisition and evaluation of moving objects. Read more ›

As part of its xiLAB initiative, XIMEA expands the xiJ family of cooled sCMOS cameras with models for XUV and Soft X-ray imaging.
For a long time, the diffraction limit defined by Ernst Abbe defined the natural barrier that restricts the resolution of small objects.
To overcome this limitation multiple techniques like STED, STORM, PALM, TEM or others were developed, using advanced illumination and detection technologies.
In its original sense, the Abbe limit states, that the shorter the wavelength of the particle, the higher the resolution. Therefore the observability to resolve small structural features in the image is also higher. Read more ›