Welcome to the EMVA newsletter! Each month it provides hands-on information on machine vision in Europe and the world. Find out about the latest projects of the EMVA, innovative products, what’s going on in the machine vision industry and interesting events.
Kind regards, Thomas Lübkemeier
EMVA General Secretary
EMVA News
EMVA Business Conference
More than 50 attendees from 12 countries already registered
Professionals from Europe and abroad are looking forward to the 2017 edition of the EMVA conference in Prague. Details about speakers and programme will be published in this newsletter and at the EMVA associaitopn website soon.
In good tradition the 2017 winner of the Young Professional Award will be announced at the conference. For the first time the award is endowed with € 1500 besides of the opportunity to present the awarded work at the conference. Download the Call for Papers.
Don’t miss the opportunity to benefit from informative presentations touching various topics of technical innovation, application, management and marketing in our industry. Make use of prescheduled face-to-face meetings and meet your peers during the social networking events.
Taking place 22 – 24 June 2017 in Prague, Czech Republic, the EMVA conference again will be one of the top highlights for our industry in 2017.
Debut of first European Embedded Vision Conference
Embedded VISION Europe – Event Website Online
The EMVA and the trade show VISION organize the first European conference on Embedded Vision, the Embedded VISION Europe, from 12-13 October 2017 at the ICS International Congress Center Stuttgart right next to Stuttgart Airport.
Embedded VISION Europe 2017, the only conference in Europe having the focus exclusively on this disruptive technology, will show the capability of hardware and software platforms; will present applications and markets for embedded vision and will create a platform for the exchange of information. The conference will be held in English language and is organized jointly by the EMVA and Landesmesse Stuttgart which organizes and hosts the biannual international trade show VISION.
The first Embedded VISION Europe targets developers and users of embedded (vision) systems from all industries. The conference will be supplemented by an exhibition where all participating companies are invited to show their embedded vision competence through products and applications.
Xilinx Vision Technology Workshop:
Right before the Embedded VISION Europe opens, Xilinx invites software developers to join the workshop ‘Embedded Vision Innovation Day for Software Developers‘ on 11 October 2017.
The workshop is organised as co-event of the Embedded VISION Europe and all further details and registration may be found via the conference website and registration portal.
The GenICam standard group has released the GenTL Standard Features Naming Convention (SFNC) version 1.1. The new release is in sync with latest GenICam GenTL specification v1.5 and defines in particular also the features for multipart buffers. Through this the GenICam standard is now entirely “Ready for 3D” and available to standardize the software interface not only for the classical 2D camera use case, but also for 3D sensors. Furthermore, the release defines a new optional buffer mode “NewestOnly” for live display applications and also defines features for event control. www.genicam.org
Member News
LMI Technologies Promotes Len Chamberlain to VP Sales
LMI Technologies announced the promotion of Len Chamberlain to VP Sales.
Len has worked for the company over the last three years, starting out as the Business Development Manager for the HDI product line and moving quickly into the Director of Sales role. Over his two years as Director, Len’s proven track record for developing and executing a strategic vision has resulted in the growth of a highly successful global sales group. Read more ›
Advertising
Heidelberg Image Processing Forum
EMVA Members Receive 10% Fee Reduction
Starting with the 64. Heidelberg Image Processing Forum, EMVA members will receive a 10% discount.
The Forum is an initiative of the EMVA member Heidelberg Collaboratory of Image Processing, or short HCI, an Industry-on-Campus Project of Heidelberg University, for continuous education, networking and information exchange between industry and research. The one-day German language event takes place three times per year, each time with another topical focus. The the next event “3-D Imaging with Penetrating Radiation” will take place on Tuesday, March 7 at the Fraunhofer Development Center for X-Ray Technology in Fürth, Germany. Read more ›
Case Study
COGNEX:
Barcode readers with real-time monitoring increase the speed of article picking
Cognex is equipping more and more logistics centres with image-based barcode readers. Zalando, Europe’s leading online platform for fashion, has now installed Cognex DataMan 503 barcode readers at its logistics centre in Erfurt, where it has been able to measurably increase the reading rate on the linear sorter. The image-based devices reduce extra work by means of RTM (a real-time monitoring function) and increase the efficiency of article picking.. Read more ›
FUJINON HF-XA series from Fujifilm is extended with a 6mm lens compatible with 2/3” and 5 megapixel sensors.
FUJIFILM Europe GmbH has announced the release of the new lens HF6XA-5M for Machine Vision applications as an addition to the Fujinon HF-XA series. This new lens offers 6mm focal length, supports 3.45 µm pixel pitch on a 2/3” sensor format (equals 5 megapixels) and delivers stable sharpness from the image center to the corners. Read more ›
MIKROTRON EoSens Quad 1.1 sets new standards for compact size and weight for rugged high-speed recording cameras
Mikrotron GmbH introduces its new high-speed recording camera EoSens Quad 1.1. With a shock resistance of 100 G’s the fanless high-speed recording camera has been specifically designed to meet the demands of high shock and vibration environments. The compact design with dimensions of 63x63x95 mm (C-Mount), the smallest cross section and lightest weight of any camera on the market at only 500 grams make the Quad 1.1 ideal for applications such as automotive crash tests.Read more ›
TATTILE introduces its M100 CLink Multi-Camera Vision Controller
Compared to classic industrial PCs the M100 CLink Vision Controller combines a number of advantages for ease of installation: It is Fanless with a compact and rugged construction, and comes out of the box ready-to-use requiring no loading of any OS software or drivers or any additional components such as a frame grabber or switch, and it contains an FPGA-enabled real time I/O allowing for extremely low-latency synchronization between vision system, cameras and machine automation. Read more ›
Teledyne DALSA Newest Genie Nano Camera Features ON Semiconductor’s 18M Sensor
Teledyne DALSA introduced a new model to its high-value Genie™ Nano GigE Vision camera series. Built around the ON Semiconductor® AR1820HS 18 Megapixel, backside illuminated (BSI) image sensor, this new camera (C4900) brings system integrators and OEMs even greater choice from a growing number of Genie Nano models powered by more than 40 industry-leading CMOS imagers. Read more ›
LMI Technologies announced the promotion of Len Chamberlain to VP Sales.
Starting with the 64. Heidelberg Image Processing Forum, EMVA members will receive a 10% discount.
Cognex is equipping more and more logistics centres with image-based barcode readers. Zalando, Europe’s leading online platform for fashion, has now installed Cognex DataMan 503 barcode readers at its logistics centre in Erfurt, where it has been able to measurably increase the reading rate on the linear sorter. The image-based devices reduce extra work by means of RTM (a real-time monitoring function) and increase the efficiency of article picking.. 
Compared to classic industrial PCs the M100 CLink Vision Controller combines a number of advantages for ease of installation: It is Fanless with a compact and rugged construction, and comes out of the box ready-to-use requiring no loading of any OS software or drivers or any additional components such as a frame grabber or switch, and it contains an FPGA-enabled real time I/O allowing for extremely low-latency synchronization between vision system, cameras and machine automation. 
Teledyne DALSA introduced a new model to its high-value Genie™ Nano GigE Vision camera series. Built around the ON Semiconductor® AR1820HS 18 Megapixel, backside illuminated (BSI) image sensor, this new camera (C4900) brings system integrators and OEMs even greater choice from a growing number of Genie Nano models powered by more than 40 industry-leading CMOS imagers. 
