July 2023 – EMVA

LogiMAT 2024 – International Trade Show for Intralogistics Solutions and Process Management – will take place 19 – 21 March 2024 in Stuttgart, Germany.

EMVA member entities are offered the exclusive chance to become co-exhibitor at the ‘EMVA Member Booth‘ during LogiMAT 2024.
Based on positive feedback received from several member entities the EMVA has booked a 100 sqm booth area and booth layout and comercial proposal are in the final stage of preparing.

Soon all EMVA members will receive the respective brochure presenting all details and including order forms for becoming co-exhibitor at EMVA’s LogiMAT booth. Read more ›

Focal topic:
Real-world Machine Vision Challenges – Coping with Variability and Uncontrolled Environments

Again the EMVA together with the forum’s program committee has set up a packed AGENDA addressing the topics which matter. The impressive list of SPEAKERS represents industry, university and research instutions in a well balanced way.

KEYNOTE:
STACKED IMAGE SENSORS:
A path towards new applications in the CIS world

Stacking technology is becoming widely applied in modern CMOS image sensors. The implementation of this new processing technology started in the consumer world, but these days stacking is applied to other parts of the CIS landscape as well. Stacking of image sensors and processing chips is now also accessible through CIS foundries, so that more application fields can benefit from it.

The new technology extends the “electronic volume” of the pixels underneath the photoconversion layer. In the talk a short overview will be given about the status of the stacking technology (TSV, hybrid bonding, double and triple layer stacking). The main focus will be on the improvement of the performance parameters and on new features that can be added to the CIS now that stacking technology is becoming available.

Albert Theuwissen received the degree in electrical engineering and his PhD from the Catholic University of Leuven (Belgium) in 1977 and 1983 respectively. In 1983 he joined Philips Research Labs (the Netherlands) and in 2002 he started working for DALSA. His whole career he was involved in R&D of solid-state image sensors.

He issued several patents and he is author or coauthor of 240+ technical papers, including a textbook “Solid State Imaging with Charge Coupled Devices”. Read more ›

Alkeria designs, develops, and manufactures high-performance USB3 machine vision cameras for industrial inspection and scientific and medical applications.
Founded in 2004, Alkeria started developing machine vision cameras for OEM custom projects: the expertise gained through custom projects, has contributed to the creation of an entire line of standard products. Both activities are still carried out today, allowing the company to enrich its offer of products and services. Read more ›

Xenics is happy to announce the upgrade of its CERES family, the long-wave infrared (LWIR) thermographic cameras with different Field-of-View (FOV) options.

CERES products are a family of LWIR cameras optimized to meet today’s increased demand for high performance and highly stable and reproducible temperature measurement. The family offers two possible resolutions : VGA (640×480) and SXGA (1280×1024). These configurations allow for optimisation and are the best choices for industrial applications. Read more ›