May 2021 – EMVA

Panel Discussion ‘Industry 4.0: Emerging from the Early Years’

The EMVA is honored to announce Dr. Gunther Kegel, CEO at Pepperl+Fuchs and President of the German ZVEI, Dr. Roman Dumitrescu, Director at Fraunhofer IEM and heading the technology cluster ‘it’s OWL’ and Dr. Thomas Scheiter, Head of Technology Field ‘IoT’ at Siemens, sharing their tremendous expertise in automation and Industry 4.0 in specific.

The panel will be moderated by EMVA Board Member Dr. Kai-Udo Modrich, Head of ZEISS Inline Inspection & Metrology .

Panel Discussion
‘Machine Vision in a Global Pandemic: Impact and Opportunity’

The panel discussion at the first conference day counts on machine vision VIPs. With Arne Dehn, CEO at Stemmer Imaging, Dr. Dietmar Ley, CEO at Basler and Max Hodeau, CEO at Tiama Inspection, the panel represents decades of experience in the Vision Tech industry combined with outstanding technical and management knowledge.

The discussion on how Corona has impacted our industry will be moderated by expert and insider Dr. Peter Ebert, Editor-in Chief at the inVision magazine.

The German embedded vision pioneer Vision Components celebrates its 25th anniversary in 2021.

The year was duly kicked off with a major product launch: VC picoSmart, currently the world’s smallest embedded vision system. The anniversary will also be marked by a webinar series and a hackaton under the motto, ‘There must be a better way to do this’ – a mindset that has always driven product development in the company. In 1995, CEO Michael Engel developed and presented the world’s first industrial-grade smart camera. Founding the company in the year after and taking up series production, he profoundly changed the machine vision market.

After twenty years as Chairman of the Executive Board, Dr. Robert Bauer will leave SICK AG on 30 September 2021. It is foreseen that he will lead the Supervisory Board of SICK AG from May 2022, taking over from Klaus M. Bukenberger, who has been its Chairman for many years.
Dr. Mats Gökstorp, responsible for the Products & Marketing portfolio, will follow Dr. Bauer as Chairman of the Executive Board from 1 October 2021. At the same time, Dr. Niels Syassen will join SICK AG’s Executive Board and take over Dr. Bauer’s responsibility for the Technology & Digitalization portfolio.
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With the IRSX Simulator, AT – Automation Technology has recently developed an optimal software tool to simulate the IRSX smart infrared camera with all its functions on the computer. This development has several advantages: The customer can familiarize himself with the infrared camera even before the actual use of the hardware and there is the possibility to extensively test, develop and optimize measurement plans completely independent of the infrared camera.
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Baumer is expanding its CX series with the 4th Sony CMOS sensor generation Pregius S with up to 24 megapixel resolution. Thanks to a pixel size of mere 2.74 µm and backside illumination pixel architecture, the camera has a very compact design of 29×29 mm and offers very high resolutions with excellent image quality and improved sensitivity for stable image evaluations. For example, detailed surface inspections can be carried out or increasingly small objects measured. Read more ›

Inspekto, the global company that pioneered Autonomous Machine Vision, has launched the INSPEKTO S70 Gen.2, a new and improved version of its famous Autonomous Machine Vision (AMV) system for industrial quality inspection.

Powered by Autonomous Machine Vision AI (AMV-AI), the S70 Gen.2 supports an even higher number of use cases and allows for reliable quality inspection in challenging applications such as highly reflective materials, moving parts and vibrating platforms.
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Ricoh Electronics Devices Co., Ltd. has launched the R5602 series, an analog front-end IC suitable for use in monitoring 4- to 7-cell battery’s cell voltages.

Battery protection has been becoming more important to ensure safety in applications using Li-ion batteries such as power tools, cleaners, electric assist bicycles, E-bikes, drones, power storages, etc. On the other hand, as operation control is becoming more complicated, an increasing number of these applications have come to adopt protection by the combination of an MCU and an analog front-end IC (hereafter, AFE) instead of conventional protective methods by hardware. Read more ›

Teledyne Imaging launches the Linea™ Lite family of line scan cameras built for a wide range of machine vision applications.
The new Linea Lite cameras feature a 45% smaller footprint than the original Linea. Based on a new proprietary CMOS image sensor from Teledyne Imaging, it expands on the success of the original series of low-cost, high-value Linea line scan cameras.
Designed to suit many applications, the Linea Lite offers customers a choice between high full well mode or high responsivity mode, via easy to configure gain settings. Read more ›

Last year marked another step in the slow discontinuation of CCD sensors. The biggest impact had the announcement of End of Life status for large format KAI sensors from ON Semiconductor (originally from Kodak and later Truesense) like the 11 Mpix KAI-11002, 16 Mpix KAI-16000 or KAI-16070 and 29 Mpix KAI-29052. XIMEA was utilizing these sensors among others in the family of compact X-ray cameras called xiRAY.

To offer equivalent or even better substitutes, the XIMEA team started working on several replacement models. These models include cameras with direct phosphor imaging or simply X-ray cameras where the scintillator is coupled with the sensor and in certain cases Taper.