September 2024

The EMVA exhibits at VISION 2024 as main organizer of the ‘International Machine Vision Standards Booth‘. Machine vision experts present the most commonly used digital interface standards in the industry in their current versions and stand by for advice on which standard should be used best for a certain application.
Besides the EMVA standards GenICam and EMVA1288, trade show visitors will find demos and information of the globally well known standards hosted by A3 (USA), JIIA (Japan) and VDMA (Germany).

Furthermore a short update presentation on the standardization activities of all a.m. organizations will be given during the ‘Industrial Vision Days’ on Tuesday, 8 November, 1.40 p.m. at booth 8C40.

International VISION Night
The traditional networking event at the evening before the VISION – this year sponsored by Messe Stuttgart and EMVA member Birger Engineering is sold out.

Get on the waiting list for last minute tickets by contacting the EMVA via info(at)emva.org.

Machine vision is often applied to solve challenges in automation, where it is superior to humans with respect to speed and reproducibility, for instance.
However, machine vision is also a promising approach in many medical fields and the human-machine interaction is of special importance in those cases.
In this context, several challenges of human-machine interaction will be addressed November 7 – 8, 2024 during the 7th edition of EMVA’s European Forum taking place in Mulhouse, France.

Francisco Javier López Tiro
PhD Student

Francisco López-Tiro is currently pursuing a Ph.D. degree at Université de Lorraine (CRAN, UMR 7039, CNRS) in Nancy, France, and at Tecnologico de Monterrey in Mexico.
He received an M.Sc. degree in biomedical sciences from INAOE (Puebla, Mexico) in 2019. Since 2022, he has been a Lecturer with the School of Engineering and Sciences, Tecnologico de Monterrey. His research interest includes the development of AI methods for medical applications such as endoscopy.

Abstract:
The formation of kidney stones in the urinary tract is a major public health issue, and at least 10% of the population suffers from a kidney stone episode. Therefore, methods for identifying the different types of kidney stones are crucial for the prescription of appropriate treatments and to reduce the risk of relapses. In order to carry out this identification in clinical practice, different procedures have been developed, such as the Morpho-Constitutional Analysis (MCA), and Endoscopic Stone Recognition (ESR). Read more ›

Continuing its interview series the EMVA this time asked Mr. Stefan Battmer, Product Owner – Machine Vision APIs & Drivers at Balluff, about his motivation to join the work on standardisation.

For me as a software developer by heart exchanging design ideas with a group of experts from all over the world was kind of a dream coming true. What could result in a better solution than something that has been approved by an international group of people facing similar or even the same challenges than yourself? As a result, to me it comes as no surprise, that GenICam and the various documents and …. . Read more ›

Valens Semiconductor is a leader in high-performance connectivity, enabling companies to transform the digital experiences of people worldwide. Valens’ chipsets are used by market-leading manufacturers, offering reliable, unprecedented extension capabilities for machine and embedded vision systems, state-of-the-art audio-video installations, next-generation videoconferencing, and ADAS and autonomous vehicles. Pushing the boundaries of connectivity, Valens technology sets the standard everywhere it operates, forming the basis for leading industry standards such as HDBaseT® and MIPI A-PHY. Read more ›

New name, new logo, new company slogan: With a clear focus on the manufacture of components, AT – Automation Technology is now presenting itself under the AT Sensors brand. “The renaming reflects the strategic decision of recent years to withdraw from the systems business and instead concentrate on the development and production of solution-oriented sensors,” says CEO Daniel Seiler, explaining the company’s rebranding.
AT founder and CTO André Kasper adds: “It goes without saying that our customers will continue to benefit from our extensive application experience, which we have steadily accumulated as a long-standing system integrator. This puts us in a position to develop highly innovative products and consistently live up to our reputation as one of the global players in the image processing industry.”
Read more ›

The Special Show »Non-Contact Measurement Technology« at the leading international trade fair for quality assurance »Control« in Stuttgart, May 6 to 9, 2025, will be held for the 19th time and will present the latest developments and pioneering technologies from the field of non-contact measuring and testing technology. The Special Show is the marketplace of innovations for both exhibitors and trade fair visitors and will be on display in a centrally located position in hall 7. The Special Show has been organized for almost twenty years by Fraunhofer Business Unit Vision in cooperation with the Control trade fair organizer, P. E. Schall GmbH & Co. KG.
Interested companies, universities or institutes are invited to submit their proposals for exhibits by October 30, 2024. Read more ›

Basis for efficient and sustainable recycling processes.
Our customer eutecma GmbH is a leading manufacturer of cooling solutions for the transport of temperature-sensitive products in the food and pharmaceutical sectors. Through its retecma division, the Mannheim-based company is implementing the world’s first recycling cycle for modular cooling boxes in sizes from 4 litres to 1588 litres.
These EPS (expanded polystyrene) boxes are equipped with RFID chips that give each component a unique identity including type, weight and number of recycling cycles. Used or no longer required boxes can be returned to special “refreshment centres” where they enter a cycle that guarantees their reuse.
Read more ›

Teledyne DALSA is pleased to introduce the Linea™ HS2 TDI line scan camera family. Drawing on over four decades of industry leading expertise, this innovative camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput.
The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. Read more ›

Teledyne e2v is pleased to announce its new Optimom™ 5D turnkey imaging module. The new imaging module features the recently announced Topaz5D™ image sensor, a compact board, standard connector, and a pre-assembled lens.

This comprehensive board-level vision extension seamlessly integrates full-HD 2D vision with the generation of 3D depth data. It excels in challenging light conditions enabling the delivery of 3D objects or human visualisation based on the detected contrast.

Imperx announces a new model in the popular family of ruggedized Cheetah industrial cameras. The CLF-C13K0-T is a 127MP global shutter camera with Camera Link® output and integrated thermoelectric cooling. The camera is based on the Sony Pregius IMX661 CMOS image sensor with native resolution 13440 x 9560 in a 3.6” optical format with 3.45 µm global shutter pixels. Combining high resolution, high sensitivity, 71dB dynamic range, low dark current and temperature stabilization, the camera is ideal for a broad range of demanding applications including flat panel inspection, semiconductor inspection, PCB inspection, color measurement, metrology, and aerial imaging. Read more ›

Nuvo-2822 is a compact expansion box PC powered by an Intel® Alder Lake N CPU featuring two PCIe and two PCI slots. The expansion slots are designedto support various frame grabbers, motion control cards, COM port expansion cards, and data acquisition cards.
With up to five times the performance boost compared to our previous Nuvo-2400 series, the new Nuvo-2822 can efficiently process vast amounts of data acquired from extensive I/O interfaces in real time. It features two Ethernet ports with I210-IT controllers, and two USB 3.2 Gen 2 ports with screw lock mechanisms to connect and secure industrial cameras for machine vision applications. Read more ›

AI-InfraSolutions, a leader in geospatial mapping technology, has partnered with STEMMER IMAGING to develop an innovative 360-degree panoramic camera head that is set to redefine the future of geospatial mapping. By integrating AI-InfraSolutions’ mobile mapping expertise with STEMMER IMAGING’s advanced More Engineering Services and the technical expertise of the engineers at STEMMER IMAGING’s Technical Competence Center (TCC), this collaboration marks a significant advancement in high-quality geospatial data acquisition and analysis.
Read more ›

With the advancement of Industry 4.0, machine vision plays a crucial role, and telecentric lenses excel in this field. For instance, in li-ion battery inspection, our DTCM series is suitable for several reasons. It offers excellent imaging quality, with a high resolution of up to 151MP and support for 3.75μm pixel size. This series features a standard modular design, offering up to 238 front- and rear-end combinations while maintaining exceptional uniformity. Additionally, our 3D AOI series provides zero-shadow and low-distortion images through its RGB confocal and high telecentric design. This series offers flexible WD ranging from 45mm to 250mm. From every aspect, it’s an ideal choice for PCBA inspection. Overall, our two series lenses are perfect for your accurate and efficient inspection in automation manufacturing. Read more ›